首頁 >TMCSE1A336KTRF>規(guī)格書列表
| 零件編號(hào) | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
PL/LSeries | NECRenesas Electronics America 瑞薩日本瑞薩電子株式會(huì)社 | NEC | ||
PL/LSeries | NECRenesas Electronics America 瑞薩日本瑞薩電子株式會(huì)社 | NEC | ||
SurfacemountresinmoldedchipwithBuilt-infuse,Lowblow-outcurrent(2A) SurfacemountresinmoldedchipwithBuilt-infuse,Lowblow-outcurrent(2A) TheSV/Fseriesfeaturesabuilt-infusetominimizecircuitdamagefromovercurrentbyprotectionwithlessthanahalfblow-outcurrentoftheformertype. Thisfuse-protectedcapacitorissuitablefornoiseabsorpt | NECRenesas Electronics America 瑞薩日本瑞薩電子株式會(huì)社 | NEC | ||
Chiptantalumcapacitorswithopen-functionbuilt-in | ROHMRohm 羅姆羅姆半導(dǎo)體集團(tuán) | ROHM | ||
Chiptantalumcapacitorswithopen-functionbuilt-in | ROHMRohm 羅姆羅姆半導(dǎo)體集團(tuán) | ROHM | ||
Chiptantalumcapacitorswith(Fail-safeopenstructuretype) | ROHMRohm 羅姆羅姆半導(dǎo)體集團(tuán) | ROHM | ||
Chiptantalumcapacitors | ROHMRohm 羅姆羅姆半導(dǎo)體集團(tuán) | ROHM | ||
ManganeseDioxideType | SamsungSamsung semiconductor 三星三星半導(dǎo)體 | Samsung | ||
ManganeseDioxideType | SamsungSamsung semiconductor 三星三星半導(dǎo)體 | Samsung | ||
ManganeseDioxideType | SamsungSamsung semiconductor 三星三星半導(dǎo)體 | Samsung |
| 供應(yīng)商 | 型號(hào) | 品牌 | 批號(hào) | 封裝 | 庫存 | 備注 | 價(jià)格 |
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