PF28F1602C3TD70

Intel? Advanced+ Boot Block Flash Memory (C3)

Introduction\nThis document contains the specifications for the Intel? Advanced+ Boot Block Flash Memory (C3) Stacked Chip Scale Package (SCSP) device. C3 SCSP memory solutions are offered in the following combinations:\n? 32-Mbit flash + 8-Mbit SRAM\n? 32-Mbit flash + 4-Mbit SRAM\n? 16-Mbit flash +; ■ Flash Memory Plus SRAM\n?? —Reduces Memory Board Space\n????? Required, Simplifying PCB Design\n????? Complexity\n■ SCSP Technology\n?? —Smallest Memory Subsystem Footprint\n?? —Area : 8 x 10 mm for 16 Mbit (0.13 μm)\n????? Flash + 2 Mbit or 4 Mbit SRAM\n?? —Area : 8 x 12 mm for 32 Mbit (0.13 μm)\;

RD28F1602C3TD70

3VOLTINTELAdvancedBootBlockFlashMemory(C3)Stacked-ChipScalPackageFamilye

Introduction ThisdocumentcontainsthespecificationsfortheIntel?Advanced+BootBlockFlashMemory(C3)StackedChipScalePackage(SCSP)device.C3SCSPmemorysolutionsareofferedinthefollowingcombinations: ?32-Mbitflash+8-MbitSRAM ?32-Mbitflash+4-MbitSRAM ?16-Mbitflash

PF318

微芯
TSOP48

微芯

PF38F4050M0Y0QD

A
BGA

A

PF38F4060M0Y3CE

NUMONXY
BGA

NUMONXY