首頁 >NTK26/16>規(guī)格書列表
零件編號(hào) | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
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ThyristorModules | ISCInchange Semiconductor Company Limited 無錫固電無錫固電半導(dǎo)體股份有限公司 | ISC | ||
PowerBridgeRectifiers | SemikronSemikron International 賽米控丹佛斯 | Semikron | ||
PowerBridgeRectifiers | SemikronSemikron International 賽米控丹佛斯 | Semikron | ||
3~phase | SemikronSemikron International 賽米控丹佛斯 | Semikron | ||
RectifierDiodeModules RectifierDiodeModules | SemikronSemikron International 賽米控丹佛斯 | Semikron | ||
Lowthermalresistance MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte | VishayVishay Siliconix 威世科技威世科技半導(dǎo)體 | Vishay | ||
Lowthermalresistance MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte | VishayVishay Siliconix 威世科技威世科技半導(dǎo)體 | Vishay | ||
Lowthermalresistance MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte | VishayVishay Siliconix 威世科技威世科技半導(dǎo)體 | Vishay | ||
Lowthermalresistance MECHANICALDESCRIPTION TheAAPGen7(TO-240AA),newgenerationofAPPmodule,combinestheexcellentthermalperformancesobtainedbytheusageofexposeddirectbondedcoppersubstrate,withadvancedcompactsimplepackagesolutionandsimplifiedinternalstructurewithminimizednumberofinte | VishayVishay Siliconix 威世科技威世科技半導(dǎo)體 | Vishay | ||
MATERIAL:BAKELITEXPOREQUIVALENTOROPAQUEMYLAR | FERROXCUBEFERROXCUBE INC. 飛利浦飛利浦元件公司 | FERROXCUBE |
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