CSD97376Q4M.B中文資料德州儀器數(shù)據(jù)手冊PDF規(guī)格書

1 Features

1? 90% System Efficiency at 15 A

? Max Rated Continuous Current 20 A, Peak 45 A

? High-Frequency Operation (up to 2 MHz)

? High-Density SON 3.5-mm x 4.5-mm Footprint

? Ultra-Low Inductance Package

? System Optimized PCB Footprint

? Ultra-Low Quiescent (ULQ) Current Mode

? 3.3-V and 5-V PWM Signal Compatible

? Diode Emulation Mode with FCCM

? Input Voltages up to 24 V

? Tri-State PWM Input

? Integrated Bootstrap Diode

? Shoot-Through Protection

? RoHS Compliant – Lead-Free Terminal Plating

? Halogen Free

2 Applications

? Ultrabook/Notebook DC/DC Converters

? Multiphase Vcore and DDR Solutions

? Point-of-Load Synchronous Buck in Networking,

Telecom, and Computing Systems

3 Description

The CSD97376Q4M NexFET? power stage is a

highly optimized design for use in a high-power, highdensity

synchronous buck converter. This product

integrates the driver IC and NexFET technology to

complete the power stage switching function. The

driver IC has a built-in selectable diode emulation

function that enables DCM operation to improve light

load efficiency. In addition, the driver IC supports

ULQ mode that enables Connected Standby for

Windows? 8. With the PWM input in tri-state,

quiescent current is reduced to 130 μA with

immediate response. When SKIP# is held at tri-state,

the current is reduced to 8 μA (typically 20 μs is

required to resume switching). This combination

produces a high-current, high-efficiency, and highspeed

switching device in a small 3.5-mm × 4.5-mm

outline package. In addition, the PCB footprint has

been optimized to help reduce design time and

simplify the completion of the overall system design.