首頁 >CDBF0240整流器件>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
LowVFSMDSchottkyDiodes | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603(1608)Standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method20 | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Goldplated,solderableper | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP | ||
SMDSchottkyBarrierDiode Features -Lowstoredcharge. -Majoritycarrierconduction. -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowforwardvoltage. | COMCHIPComchip Technology 典琦典琦科技股份有限公司 | COMCHIP |
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