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首頁 >CDBF0240整流器件>規(guī)格書列表

零件編號(hào)	下載訂購	功能描述/絲印	制造商上傳企業(yè)	LOGO
CDBFR0240	文件：77.93 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:1005(2512)standardpackage, moldedplastic. Terminals:Goldplated,solderableper	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBFR0240-HF	文件：237.3 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:1005/SOD-323Fstandardpackage, moldedplastic. -Terminals:Goldplated,solderableper	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0240L-HF	文件：103.16 Kbytes Page：4 Pages	LowVFSMDSchottkyDiodes	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQC0240LR-HF	文件：104.82 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBQR0240LR-HF	文件：124.6 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0240	文件：151.42 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603(1608)Standardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD-750,method20	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBU0240-HF	文件：202.52 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0240	文件：78.61 Kbytes Page：2 Pages	SMDSchottkyBarrierDiode Io=200mA VR=40Volts Features Designedformountingonsmallsurface. Extremelythin/leadlesspackage. Majoritycarrierconduction. Mechanicaldata Case:0603(1608)standardpackage, moldedplastic. Terminals:Goldplated,solderableper	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBUR0240-HF	文件：348.76 Kbytes Page：4 Pages	SMDSchottkyBarrierDiode Io=200mA VR=40Volts RoHSDevice HalogenFree Features -Designedformountingonsmallsurface. -Extremelythin/leadlesspackage. -Majoritycarrierconduction. Mechanicaldata -Case:0603/SOD-523Fstandardpackage,moldedplastic. -Terminals:Goldplated,solderableperMIL-STD	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP
CDBWL0240L-HF	文件：449.18 Kbytes Page：3 Pages	SMDSchottkyBarrierDiode Features -Lowstoredcharge. -Majoritycarrierconduction. -Designedformountingonsmallsurface. -Extremelythinpackage. -Lowforwardvoltage.	COMCHIPComchip Technology 典琦典琦科技股份有限公司	COMCHIP

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