首頁 >C2012JB1H334KB>規(guī)格書列表
| 零件編號 | 下載 訂購 | 功能描述/絲印 | 制造商 上傳企業(yè) | LOGO |
|---|---|---|---|---|
GeneralMultilayerCeramicChipCapacitorsCSeries FEATURES ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemain | TDKTDK Corporation TDK株式會社東電化（中國）投資有限公司 | TDK | ||
GeneralMultilayerCeramicChipCapacitorsCSeries FEATURES ?Highcapacitancehasbeenachievedthroughprecisiontechnologiesthatenabletheuseofmultiplethinnerceramicdielectriclayers. ?Amonolithicstructureensuressuperiormechanicalstrengthandreliability. ?High-accuracyautomaticmountingisfacilitatedthroughthemain | TDKTDK Corporation TDK株式會社東電化（中國）投資有限公司 | TDK |
| 供應商 | 型號 | 品牌 | 批號 | 封裝 | 庫存 | 備注 | 價格 |
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